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Polyimide Resin(frp) - List of Manufacturers, Suppliers, Companies and Products

Polyimide Resin Product List

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SKYBOND <Heat-resistant FRP Polyimide Varnish>

SKYBOND <Heat-resistant FRP Polyimide Varnish>

Heat-resistant composite materials / heat-resistant adhesive "Skybond"

Skybond is a varnish based on the most thermally stable aromatic polyimide. It was developed by Monsanto in the United States, and I.S.T acquired the manufacturing and sales rights in April 1996, producing it at the Monsanto Indian Orchard plant in Massachusetts. However, in 2014, the plant was relocated, and it is now produced at the I.S.T New Jersey plant. Skybond can form extremely excellent polyimide prepregs and honeycombs with high thermal resistance and flexibility by combining with high-strength heat-resistant fibers such as glass fibers, carbon fibers, and aramid fibers. It can also be used as a heat-resistant adhesive and sealant. Its applications are mainly in the aerospace field, used in aircraft structural materials, jet engine covers, and wing components. Additionally, taking advantage of its excellent heat resistance, it is used as insulation covers for structures and engines that operate at high temperatures. Heat-resistant bearings and bushes utilizing powder molding properties are also used in a wide range of fields, including office automation equipment. The resin's exceptionally high thermal stability, mechanical and electrical properties, and high reliability are backed by years of proven performance, and its applications continue to expand into aircraft and industrial equipment.

  • Engineering Plastics

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Thermoplastic polyimide resin "Saprime" for super engineering plastic alloy applications.

Thermoplastic polyimide resin "Saprime" for super engineering plastic alloy applications.

Suprem (TPI) can be used for alloying with various super engineering plastics (TPI, PEI, PES, PPSU, LCP, PEEK).

Introducing the applications of Suprem's super engineering plastics alloy. Suprem is a crystalline super engineering plastic with high heat resistance (Tg: 185°C, Tm: 323°C) and high fluidity, allowing for a high content of fillers and other additives. By leveraging Suprem's characteristics of high heat resistance, crystallinity, low water absorption, and flexibility, improvements in various properties can be expected through alloying with various super engineering plastics. 【Features】 ■ Alloyed product of crystalline thermoplastic polyimide (TPI) resin ■ Crystallinity derived from Suprem is maintained even in alloyed products ■ Expected reinforcement effects through fiber reinforcement *For more details, please refer to the PDF document or feel free to contact us.

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Thermoplastic Polyimide Resin "Therplim"

Thermoplastic Polyimide Resin "Therplim"

Thermoplastic polyimide resin with unprecedented moldability and heat resistance.

Compared to super engineering plastics like PEEK and PEKK, "Therplim" has a well-balanced glass transition temperature (Tg185℃) and melting point (Tm323℃), featuring high strength, high heat resistance, high solvent resistance, and low dielectric constant. It is a thermoplastic polyimide resin that possesses characteristics of (10GHz 2.66) and is easy to mold. It is a crystalline TPI that maintains a high glass transition temperature while lowering its melting point, with a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic applications that utilize its properties. [Features] ■ Crystalline thermoplastic polyimide (granules, powders) ■ High heat resistance and high strength ■ Easy moldability ■ Reflow resistance ■ Low dielectric properties and high lubricity *For more details, please refer to the PDF document or feel free to contact us.

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Thermoplastic polyimide resin Therplim powder filler application for toughness modifier in CFRP.

Thermoplastic polyimide resin Therplim powder filler application for toughness modifier in CFRP.

Improved toughness, enhanced sliding properties, and low dielectric effects from various powder additives! Introduction to powder filler applications.

Introducing the powder filler application of Therplim (filler). The effects of adding powder include improved heat resistance, enhanced mechanical properties, and improved sliding properties. For example, it provides toughness and reduces weight for high heat-resistant CFRP. 【Effects of Adding Powder】 ■ Improved heat resistance ■ Increased toughness ■ Enhanced mechanical properties ■ Improved sliding properties ■ Increased chemical resistance ■ Low dielectric * For more details, please refer to the PDF document or feel free to contact us.

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Thermoplastic polyimide Therplim

Thermoplastic polyimide Therplim

Polyimide resin that has both moldability and heat resistance.

"Therplim" shows a well-balanced glass transition point (Tg185 ℃) and melting point (Tm323 ℃) compared to super engineering plastics such as PEEK. A crystalline TPI that maintains a high Tg while lowering its melting point. We can provide powder and pellets. 【Features】 ・Crystalline resin ・high strength ・high heat resistance ・high solvent resistance ・low dielectric constant ・easy molding processing ・Insoluble in solvent ※For details, please see the PDF document or feel free to contact us.

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Thermoplastic polyimide resin "Saprime"

Thermoplastic polyimide resin "Saprime"

A thermoplastic polyimide resin that combines unprecedented moldability and heat resistance.

"Suprem" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK, and combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, and it has a wide range of applications such as CFRP matrix resin, CFRP toughness modifiers, compounds, and electrical and electronic uses, leveraging its characteristics. [Features] ■ Crystalline thermoplastic polyimide (pellets, powder) ■ Insoluble in solvents ■ High heat resistance, high strength ■ Easy moldability ■ Reflow resistant ■ Low dielectric, high lubricity *For more details, please refer to the PDF document or feel free to contact us.

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Polyimide Therplim Low Friction Grade

Polyimide Therplim Low Friction Grade

Suitable for complex-shaped components and high-performance molded parts! High fluidity allows for high fiber filling.

Introducing our crystalline thermoplastic polyimide "Therplim Low Friction Grade." It is suitable for applications requiring a high Tg (185°C) and serves as an alternative to super engineering plastics like PEEK. * For more details, please refer to the PDF document or feel free to contact us.

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Thermoplastic polyimide resin "Saprime Powder"

Thermoplastic polyimide resin "Saprime Powder"

Drive blendable! Micronized powder of heat-resistant polyimide resin that can also be processed by melting.

"Saprime" is a thermoplastic polyimide resin that demonstrates a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic uses. "Saprime Powder" is a fine powder of heat-resistant polyimide resin. Despite being a fine particle, it has a uniform particle size and can be melt-formed above the melting point. [Features] - Crystalline thermoplastic polyimide - Insoluble in solvents - Fine powder with a sharp particle size distribution - Milky white powder - Can be drive blended - Low dielectric, high heat resistance, and meltable *For more details, please refer to the PDF document or feel free to contact us.

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Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Suitable for super engineering plastics with good dielectric properties in a wide frequency range and materials for next-generation (5G) communication devices.

Due to its excellent dielectric properties and high temperature and humidity resistance, "Therplim" can be used in 5G-related materials (copper-clad laminates), CFRP raw materials, and audio equipment components. [Features] ■ Good dielectric characteristics across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance, insoluble in solvents ■ Can be processed from films below 25 μm to large components with a thickness of 100 mm * For more details, please refer to the PDF document or feel free to contact us.

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『Therplim』 Low Friction Grade

『Therplim』 Low Friction Grade

For complex shape members and high-performance molded members!

Introducing the crystalline thermoplastic polyimide "Therplim Fiber Reinforced Grade". It is suitable for applications that require high Tg (185℃) as an alternative to super engineering plastics such as PEEK.

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Examples of Suprem Film Molding

Examples of Suprem Film Molding

Introducing examples of film molding of Surprim, boasting low dielectric properties and high toughness, with Tg of 185°C and Tm of 323°C!

Here is an introduction to examples of film molding using "Saprime." "Saprime" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic applications. 【Features】 ■ Low dielectric properties ■ Low water absorption ■ High visibility ■ High toughness ■ High Tg (185°C) ■ Crystalline film *For more details, please refer to the PDF materials or feel free to contact us.

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Thermoplastic polyimide resin "Saprime" [Excellent moldability and heat resistance!]

Thermoplastic polyimide resin "Saprime" [Excellent moldability and heat resistance!]

This is a resin that combines excellent moldability and heat resistance, available for use in various fields such as industrial parts, aerospace, automotive, and energy!

Mitsubishi Gas Chemical's "Therplim" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature and melting point, along with high strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability. Samples are available upon request! 【Features】 ■ Excellent moldability with a glass transition temperature (Tg) of 185 degrees and a melting point (Tm) of 323 degrees ■ High strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability ■ Suitable for various applications such as melt-extruded films, machining, and injection molding ■ Used in 5G FCCL, test sockets, various sliding compound grades, CFRP, and toughness modifiers *For more details, please request documentation or download the PDF data.

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Introduction of exhibited products at "Chemical Material Japan 2020"

Introduction of exhibited products at "Chemical Material Japan 2020"

Polyimide resin, which is expected to be utilized in various fields including 5G-related applications and aerospace. Product materials are being provided.

Our company will be exhibiting at "Chemical Materials Japan 2020," which will be held online from October 19 to November 18, 2020. 【Exhibited Products Features】 ■ Thermoplastic Polyimide Resin 'Supreme TO65' - Excellent moldability with a Tg of 185°C and a Tm of 323°C - Suitable for various applications such as melt-extruded films, machining, and injection molding ■ Heat-Resistant Transparent Polyester Resin 'ALTESTER Series' - Developed a new grade with a glass transition temperature up to 50°C higher than PET - Currently developing a new grade with crystallinity - Maintains transparency while improving impact resistance ■ Thermosetting Resin 'CYTESTER' - Cures by forming a triazine ring Excellent processability, with high glass transition temperature, low thermal expansion, and low dielectric properties after curing ■ Special Polyol 'SPG (Spiroglycol)' - Symmetrical and stable molecular structure - Incorporating into polymers enhances heat resistance, impact resistance, hardness, and moldability ■ Special Polyol 'DOG (Dioxanediol)' - Can impart flexibility when incorporated into polymers *For more details about each product, please refer to the materials or feel free to contact us.

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